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Semiconductors (Back-end)

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Customized Systems for High-tech Production

5G, autonomous driving, and AI are the driving forces behind new applications for networking machines and devices – applications that will continue to change our lives. Memory chips have a significant impact in this context and are included in all chains of action. High-performance microelectronics is a key technology for success in international competition. The production of semiconductors therefore brings with it particular requirements for the automation components: they must be absolutely vibration-free, with high speeds and positioning accuracy in the nano-range. This is another area where WEISS can provide customized multi-axis system solutions for many processes, ranging from dicing and die bonding to assembly.

Typical Processes

  • Wafer dicing with XY systems
  • Wafer inspection
  • Die bonding
  • Wafer-level packaging based on our gantry systems

Application Examples

Wafer Inspection

Wafer Inspection

Customized XY system for macro and micro inspection

Wafer Level Packaging

Wafer Level Packaging

Highest process accuracy with flexible standard system on granite