Semiconductors (Back-end)
![Content Image](/industrysegements/electronic/936/image-thumb__936__content-image/segments-semiconductor.jpg)
Customized Systems for High-tech Production
5G, autonomous driving, and AI are the driving forces behind new applications for networking machines and devices – applications that will continue to change our lives. Memory chips have a significant impact in this context and are included in all chains of action. High-performance microelectronics is a key technology for success in international competition. The production of semiconductors therefore brings with it particular requirements for the automation components: they must be absolutely vibration-free, with high speeds and positioning accuracy in the nano-range. This is another area where WEISS can provide customized multi-axis system solutions for many processes, ranging from dicing and die bonding to assembly.
Typical Processes
- Wafer dicing with XY systems
- Wafer inspection
- Die bonding
- Wafer-level packaging based on our gantry systems
Application Examples
![Wafer Inspection](/Applications/Electronics/Semiconductors/1374/image-thumb__1374__news-list/waferinspection-semiconductors.jpg)
Wafer Inspection
Customized XY system for macro and micro inspection
![Wafer Level Packaging](/Applications/Electronics/Semiconductors/1375/image-thumb__1375__news-list/waferlevelpackaging-semiconductors.jpg)
Wafer Level Packaging
Highest process accuracy with flexible standard system on granite