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Printed Circuit Boards

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Precision in the μ Range 

Electronic modules are becoming smaller and more complex. Wiring and packing densities are increasing continuously. As miniaturization continues to advance, traditional multilayer circuit boards are reaching their physical limits and are being replaced by HDI printed circuit boards. In manufacturing and optical inspections, this switch also means increased positioning accuracy in the micrometer range. Featuring precision systems, some based on granite, the WEISS product range also has exact custom-fit solutions for transporting, turning and moving.

Typical Processes

  • Depaneling
  • Trimming printed circuit boards
  • Producing serial tools for tactile testing / fitting these tools with test pins
  • Customized subsystems for wire bonding and flip-chip bonding

Application Examples

Depaneling of Printed Circuit Boards

Depaneling of Printed Circuit Boards

Axis system with linear motor axes HN on granite for laser cutting of printed circuit boards

PCB Inspection

PCB Inspection

Granite system for optical inspection