Wafer Level Packaging

Task

In the usual production process, packaging usually takes place only after separation into individual chips / dies. In order to simplify the production process of chips that are as small as possible, many processes still take place on the wafer.

Solution

To allow processes to take place on the wafer, a precise motion system with travels corresponding to the wafer size is required. A semi-standard solution based on a modular granite system is used, which is scalable in the traverse paths.. 

Benefits 

• The granite structure enables highest process accuracy as well as stiffness and damping, which is required for the large moving masses
• Simple customer-specific adaptation to all conditions 
• Industrial controller with standardized field bus (e.g. EtherCat, Profinet, ...)
• Easy integration into the machine environment and reduced commissioning time 
• Clean room possible