Wafer Inspection

Tasks

After production, the dies on the wafers are checked by optical inspection. Here the structure is examined by imaging processes with high resolution. To examine the complete surface of the wafer, meander scans are typically performed with an XY system.

Solution

XY systems are used, which are configured according to customer specifications. Depending on the application, both the precision classes of the linear guide and the resolution of the measuring system are adapted. Thus, macro inspection (finding defects on the wafer) as well as micro inspection (detailed examination of defects with highest resolution) can be performed with a cost-effective solution. 

Benefits

  • Accuracy adjustment with the same installation space
  • Easy integration into a customer's modular machine concept 
  • Fastest Step&Settle Time
  • Constant speed for scan movements
Semiconductors Back End

Contact Person

WEISS NA
Phone +1-888-WEISSNA (934-7762)
info.us@weiss-world.com

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