Printed Circuit Boards
Precision in the μ Range
Electronic modules are becoming smaller and more complex. Wiring and packing densities are increasing continuously. As miniaturization continues to advance, traditional multilayer circuit boards are reaching their physical limits and are being replaced by HDI printed circuit boards. In manufacturing and optical inspections, this switch also means increased positioning accuracy in the micrometer range. Featuring precision systems, some based on granite, the WEISS product range also has exact custom-fit solutions for transporting, turning and moving.
Typical Processes
- Depaneling
- Trimming printed circuit boards
- Producing serial tools for tactile testing / fitting these tools with test pins
- Customized subsystems for wire bonding and flip-chip bonding
Application Examples
Depaneling of Printed Circuit Boards
Axis system with linear motor axes HN on granite for laser cutting of printed circuit boards
PCB Inspection
Granite system for optical inspection