Depaneling of Printed Circuit Boards
Task
Often the PCB assembly machines are used to produce and assemble boards that are smaller than the actual machine size. In order to achieve optimum machine utilization, several identical assemblies (panels) are arranged on a PCB and are only separated from each other later. A distinction is made between cutting, clamping and laser depaneling.
Solution
In the customer application, many sensors are produced on one large circuit board. This board is first segmented into individual bars. In a second step, the bars are again segmented into the individual sensors. This is done in the application using the laser cutting process. For this purpose, WEISS has developed a special solution that includes both the two high-precision granite-based cutting stations as well as the interlinking between them and the downstream inspection system.
Benefits
- High positioning accuracy required.
- Complete motion system, including servo amplifier and controller